NDT เครื่องสแกนความบกพร่องชิ้นงานระบบอัลตร้าโซนิค

Bondascope 3100

- Handheld Bond Tester
- Pitch-catch, Mechanical Impedance (MIA) and Resonance modes
- Programmable user setups
- Automatic probe recognition
- Alarm modes, impedance plane

Features
- Standard package includes instrument, Pelican style shipping case, manual, battery and AC charger
- Resonance, Pitch-catch and Mechanical Impedance modes
- Auto-probe recognition and probe library
- RF Impedance plane display mode
- Time encoded bond profile display mode
- Reference display mode
- Alarm modes: Amplitude, Phase. Halo, square, ellipse ring gates
- High speed swept frequency
- Individually sizable 'ring' gates with alarms
- Compatible with probes from other manufacturers
- Splitscan and Splitview

Specification

Applications
- Multi-layered laminates
- Skin to core flaws
- Glass fiber/ carbon fiber composites
- Far-side defects
- Honeycomb and foam cores
- Impact damage
- Metal to metal bonding
- Adhesively bonded fittings
- Liquid Ingress

Accessories
- Resonance Probes
- MIA Probes
- Pitch-Catch Probes
- Protective carry case
- Battery external charger and conditioning unit

CATALOG NDT