NDT เครื่องสแกนความบกพร่องระบบอัลตร้าโซนิค Bond Testers Bondhub II

- Imaging Bond Tester
- C-scan images in Resonance, Pitch-Catch and MIA modes
- Compatible with all our scanners
- Compatible with Bondascope 3100
- Portable, battery operated, extensive image analysis
- Works with bond testers from other manufacturers
Screenshots
Specification
Physical / Case |
Weight |
25lb (11kg) |
Dimensions (W x H x D) |
7.5in. x 18.0in. x 14.0in. (191mm x 457mm x 356mm) |
Operating Temperature |
15 °F to 158 °F (-10 °C to 70 °C) |
Case Construction |
Integrated in Pelican Style case, vibration isolation |
Connector type |
USB, DVI, Multi-pin scanner connector |
PC |
Processor |
1GHz |
HDD |
128GB Solid state |
Operating System |
Windows 7 |
Peripherals |
Mini-keyboard with trackpad and separate mouse |
Display type |
Color TFT LCD sun readable 1200nit |
Display size |
800 x 600 pixels, 12.1in. (307mm) diagonal |
Operational |
Modes |
Resonance |
|
Pitch-Catch |
|
MIA (Mechanical Impedance Analysis) |
Freq range |
250Hz to 1.5MHz |
Display Modes |
C-scan- Phase, Magnitude or Additive view |
|
Impedance plane (flying dot)= direct representation of bond tester screen |
|
Strip chart- rectangular real-time streaming of outputs |
Display Analysis |
Retrace position of all dots acquired |
|
Flaw sizing- length, area |
|
Changeable gates in post-processing, Save scan plans, user setups etc. |
|
Auto and user defined scaling, mm/inch units, move scanner to position |
Image Output format |
BMP |
Gates/ Alarms |
Box, ring, sectorial individually sizable gates. LED and audible alarms |
Power Source |
Power Source |
Two Li-Ion batteries or AC charger (110-240V) |
Battery life |
4-5 hours |
Certification |
Certification |
Factory Calibration |
Warranty |
Warranty |
1 year |
Compatibility |
Bond Testers |
Bondascope 3100 |
|
Other Manufacturer's bond testers |
Scanners |
Manual Scanners: StringScan, SlideScan |
|
Automatic Scanners: CrosScan, TunnelScan |
Features
- Standard package includes BondHub integrated in Pelican style case, batteries, AC charger (110-240V), user manual. Windows 7, 1GHz processor, 128GB solid state HDD, CompVu software, keyboard, mouse, 12” sunreadable display*
- C-scan Imaging using Resonance, Pitch-Catch and Mechanical Impedance (MIA) mode
- No couplant required for Pitch-Catch and MIA modes
- Connects directly to Bondascope 3100 and manual or automatic scanners
- Image Analysis, defect sizing, multiple gates, reporting
- Portable, battery operated system, large sunreadable screen
- Compatible with bond testers from other manufacturers
Accessories
- Resonance Probes
- MIA Probes
- Pitch-Catch Probes
- Protective carry case
- Manual and Automatic Scanners
Applications
- Integrity of composites and adhesively bonded structures
- Multi-layered laminates, glass fiber/ carbon fiber composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings
- Delaminations, disbonds, crushed core, skin to core flaws, far-side defects, impact damage, liquid ingress and more
อุปกรณ์พ่วงต่อสำหรับเครื่อง Bondhub II

CATALOG NDT
